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V23138-R1005-A403 bảng dữ liệu(PDF) 5 Page - Tyco Electronics |
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V23138-R1005-A403 bảng dữ liệu(HTML) 5 Page - Tyco Electronics |
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5 / 5 page ![]() Single Nano Relay (THT – THR) PCB Relays Single Relays Catalog 1308028-2 Revised 8-2009 All specifications subject to change. Consult Tyco Electronics for latest specifications. 110 Part Numbers (see table below for coil data) Contact Contact Enclosure Soldering Relay Description Part Number Arrangement Material Technology V23138-C1005-A403 9-1414964-1 1 Form C Silver based Sealed THT V23138-R1005-A403 1-1414960-7 1 Form C Silver based Open vent hole THR Coil Versions Ordering Information Coil Data Rated Coil Coil Resistance Must Must Allowable Overdrive1) for Voltage ±10% Operate Voltage Release Voltage Voltage (V) Nano Single (V) ( Ω) (V) (V) at 23°C at 105°C V23138-**005-**** 12 180 6.9 1.0 24 14.7 1) Allowable overdrive is stated with no load applied and minimum coil resistance. Standard Delivery Packs (orders in multiples of delivery pack) Nano Single: 2600 pieces Environmental Conditions Temperature range, storage Refer to Storage in the “Glossary” catalog page 23 or http://relays.tycoelectronics.com/appnotes/ Test Relevant standard Testing as per Dimension Comments Cold storage IEC 68-2-1 1000 h –40°C Dry heat IEC 68-2-2 Ba 1000 h 125°C Climatic cycling with condensation THT EN ISO 6988 20 cycles Storage 8/16 h Thermal change IEC 68-2-14 Nb 35 cycles –40/+125°C Thermal shock IEC 68-2-14 Na 1000 cycles –40/+125°C Dwell time 1 h Damp heat cyclic THT IEC 68-2-30 Db, Variant 2 6 cycles 40°C/55°C/93% constant THT IEC 68-2-3 Method Ca 56 days 40°C/ 93% Corrosive gas IEC 68-2-42 10 days IEC 68-2-43 10 days Vibration resistance IEC 68-2-6 (sine pulse form) 10 - 500 Hz No change in the 6 g switching state > 10 μs Shock resistance IEC 68-2-27 (half sine form single pulses) 6 ms No change in the up to 30 g switching state > 10 μs Solderability Hot dip 5 s Aging 3 (4 h/ 155°C) THT IEC 68-2-20 Ta, Method 1 215°C for leaded process (Tm = 183°C) THR IEC 68-2-58 245°C for Pb-free process (Tm = 217°C) Resistance to soldering heat Hot dip 10 s with thermal screen THT IEC 68-2-20 Ta, Method 1A 260°C THR IEC 68-2-58 260°C Preheating min 130°C Sealing THT IEC 68-2-17 Qc, Method 2 1 min/ 70°C THR Open vent hole |
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