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STM32F102X8 bảng dữ liệu(PDF) 71 Page - STMicroelectronics

tên linh kiện STM32F102X8
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
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STM32F102X8 bảng dữ liệu(HTML) 71 Page - STMicroelectronics

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STM32F102x8, STM32F102xB
Package characteristics
Doc ID 15056 Rev 4
71/76
6.2
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 8: General operating conditions on page 28.
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max × ΘJA)
Where:
●
TA max is the maximum ambient temperature in °C,
●
ΘJA is the package junction-to-ambient thermal resistance, in °C/W,
●
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
●
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
6.3
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Table 53.
Package thermal characteristics
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
LQFP48 - 7 × 7 mm / 0.5 mm pitch
55
°C/W
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
45



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