DFM200PXM33-F000

2/6

www.dynexsemi.com

ABSOLUTE MAXIMUM RATINGS

Stresses above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. In

extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package.

Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect

device reliability.

Symbol

Parameter

Test Conditions

Max.

Units

Repetitive peak reverse voltage

3300

V

Forward current (per arm)

200

A

Max. forward current (per arm)

400

A

I

I

20

kA

Max. power dissipation

1040

W

Isolation voltage

– per module

Commoned terminals to base plate.

AC RMS, 1 min, 50Hz

6000

V

Partial discharge

– per module

10

pC

DC Voltage stability

25°C at sea level, 100 FITs

2200

V

THERMAL AND MECHANICAL RATINGS

Internal insulation material:

AlN

Baseplate material:

AlSiC

Creepage distance:

33mm

Clearance:

20mm

CTI (Comparative Tracking Index):

350

Symbol

Parameter

Test Conditions

Min

Typ.

Max

Units

Thermal resistance (per arm)

Continuous dissipation

–

junction to case

-

-

96

°C/kW

Thermal resistance

–

case to heatsink (per module)

Mounting torque 5Nm

(with mounting grease)

-

-

16

°C/kW

Junction temperature

-40

-

125

°C

Storage temperature range

-40

-

125

°C

Screw Torque

Mounting

– M6

-

-

5

Nm

Electrical connections

– M5

-

-

4

Nm