DAC8412BTCSLASH883 datasheet(5/14 Pages) AD

5 / 14 page

DAC8412/DAC8413

–5–

REV. D

WARNING!

ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS

A = +25

°C unless otherwise noted)

VSS to VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +33.0 V

VSS to VLOGIC . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +33.0 V

VLOGIC to DGND . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +7.0 V

VSS to VREFL . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +VSS–2.0 V

VREFH to VDD . . . . . . . . . . . . . . . . . . . . . . . . . +2.0 V, +33.0 V

VREFH to VREFL . . . . . . . . . . . . . . . . . . . . . . . . +2.0 V, VSS–VDD

Current into Any Pin 4 . . . . . . . . . . . . . . . . . . . . . . . .

±15 mA

Digital Input Voltage to DGND . . . . . –0.3 V, VLOGIC +0.3 V

Digital Output Voltage to DGND . . . . . . . . . . –0.3 V, +7.0 V

Operating Temperature Range

ET, FT, EP, FP, FPC . . . . . . . . . . . . . . . . –40

°C to +85°C

AT, BT, BTC . . . . . . . . . . . . . . . . . . . . . –55

°C to +125°C

Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . . +150

°C

Storage Temperature . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Power Dissipation Package . . . . . . . . . . . . . . . . . . . 1000 mW

Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300

°C

CAUTION

1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the

device. This is a stress rating only; functional operation at or above this specification is not implied.

Exposure to the above maximum rating conditions for extended periods may affect

device reliability.

2. Digital inputs and outputs are protected, however, permanent damage may occur on unprotected units

from high-energy electrostatic fields. Keep units in conductive foam or packaging at all times until

ready to use. Use proper antistatic handling procedures.

3. Remove power before inserting or removing units from their sockets.

4. Analog outputs are protected from short circuit to ground or either supply.

Thermal Resistance

Package Type

JA*

Units

28-Lead Plastic DIP (P)

°C/W

28-Lead Hermetic Leadless Chip Carrier (TC) 70

°C/W

28-Lead Plastic Leaded Chip Carrier (PC)

°C/W

JA is specified for worst-case mounting conditions, i. e.,

JA is specified for device

in socket.

ORDERING INFORMATION

1, 2

INL

Military

3 Temperature

Extended Industrial

3 Temperature

Package

(LSB)

–55 C to +125 C

–40 C to +85 C

Description

Option

±1

DAC8412FPC

PLCC

P-28A

±1.5

DAC8412BTC/883

LCC

E-28A

0.5

DAC8412EP

Plastic DIP

N-28

±1

DAC8412FP

Plastic DIP

N-28

±1

DAC8413FPC

PLCC

P-28A

±1.5

DAC8413BTC/883

LCC

E-28A

±0.5

DAC8413EP

Plastic DIP

N-28

±1

DAC8413FP

Plastic DIP

N-28

NOTES

1Die Size 0.225

× 0.165 inches, 37,125 sq. mils (5.715 × 4.191 mm, 23.95 sq. mm). Substrate should be connected to VDD; Transistor Count = 2595.

2Burn-in is available on extended industrial temperature range parts in cerdip.

3A complete /883 data sheet is available. For availability and burn-in information, contact your local sales office.

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