ADM232LAN datasheet(16/16 Pages) AD

16 / 16 page

24-Lead Cerdip (Q-24)

PIN 1

0.295 (7.493)

MAX

SEATING

PLANE

0.225

(5.715)

MAX

0.125

(3.175)

MIN

0.070 (1.778)

0.020 (0.508)

0.180

(4.572)

MAX

1.290 (32.77) MAX

0.021 (0.533)

0.015 (0.381)

TYP

0.065 (1.651)

0.055 (1.397)

TYP

0.110 (2.794)

0.090 (2.286)

TYP

0.320 (8.128)

0.290 (7.366)

0.012 (0.305)

0.008 (0.203)

TYP

1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH.

2. CERDIP LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED

IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.

24-Lead SOIC (R-24)

0.013 (0.32)

0.009 (0.23)

0.042 (1.067)

0.018 (0.447)

0.03 (0.76)

0.02 (0.51)

PIN 1

0.299 (7.6)

0.291 (7.39)

0.414 (10.52)

0.398 (10.10)

1. LEAD NO. 1 IDENTIFIED BY A DOT.

2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED

IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS

0.019 (0.49)

0.014 (0.35)

0.05 (1.27)

BSC

0.096 (2.44)

0.089 (2.26)

0.608 (15.45)

0.596 (15.13)

0.01 (0.254)

0.006 (0.15)

28-Lead SOIC (R-28)

0.019 (0.49)

0.014 (0.35)

0.05 (1.27)

BSC

0.708 (18.02)

0.696 (17.67)

0.01 (0.254)

0.006 (0.15)

0.096 (2.44)

0.089 (2.26)

0.013 (0.32)

0.009 (0.23)

0.042 (1.067)

0.018 (0.457)

0.03 (0.76)

0.02 (0.51)

PIN 1

0.299 (7.6)

0.291 (7.39)

0.414 (10.52)

0.398 (10.10)

1. LEAD NO. IDENTIFIED BY A DOT.

2. SOICLEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED

IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.

28-Lead SSOP (RS-28)

1. LEAD NO. 1 IDENTIFIED BY A DOT.

2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED

IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS

0.009 (0.229)

0.005 (0.127)

0.037 (0.94)

0.022 (0.559)

0.0256 (0.65)

BSC

0.407 (10.34)

0.397 (10.08)

0.008 (0.203)

0.002 (0.050)

0.07 (1.78)

0.066 (1.67)

PIN 1

0.311 (7.9)

0.301 (7.64)

0.212 (5.38)

0.205 (5.207)

–16–

ADM232LAN bảng dữ liệu(PDF) 16 Page - Analog Devices

ADM232LAN bảng dữ liệu(HTML) 16 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

bảng dữ liệu tải về

Link URL