AD8012

–4–

REV. A

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V

Small Outline Package (R) . . . . . . . . . . . . . . . . . . . . . 0.8 W

microSOIC Package (RM) . . . . . . . . . . . . . . . . . . . . . 0.6 W

Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . .

±V

S

Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . .

±2.5 V

Output Short Circuit Duration

. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves

Storage Temperature Range RM, R . . . . . . –65

°C to +125°C

Operating Temperature Range (A Grade) . .

–40

°C to +85°C

Lead Temperature Range (Soldering 10 sec) . . . . . . . +300

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

°C

8-Lead SOIC Package:

θ

°C/W

8-Lead microSOIC Package:

θ

°C/W

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the AD8012

is limited by the associated rise in junction temperature. The maxi-

mum safe junction temperature for plastic encapsulated devices

is determined by the glass transition temperature of the plastic,

approximately +150

°C. Temporarily exceeding this limit may

cause a shift in parametric performance due to a change in the

stresses exerted on the die by the package. Exceeding a junction

temperature of +175

°C for an extended period can result in de-

vice failure.

The output stage of the AD8012 is designed for maximum load

current capability. As a result, shorting the output to common

can cause the AD8012 to source or sink 500 mA. To ensure

proper operation, it is necessary to observe the maximum power

derating curves. Direct connection of the output to either power

supply rail can destroy the device.

AMBIENT TEMPERATURE – C

–50

0

2.0

1.5

1.0

8-LEAD SOIC

PACKAGE

–40 –30

0

102030

40

5060

70

80 90

8-LEAD

microSOIC

0.5

–20 –10

Figure 3. Plot of Maximum Power Dissipation vs.

Temperature for AD8012

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD8012 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ORDERING GUIDE

Temperature

Package

Package

Brand

Model

Range

Description

Options

Code

AD8012AR

–40

°C to +85°C 8-Lead SOIC

SO-8

AD8012AR-REEL

–40

°C to +85°C13” Tape and Reel

SO-8

AD8012AR-REEL7

–40

°C to +85°C7” Tape and Reel

SO-8

AD8012ARM

–40

°C to +85°C 8-Lead microSOIC

RM-08

H6A

AD8012ARM-REEL

–40

°C to +85°C13” Tape and Reel

RM-08

H6A

AD8012ARM-REEL7

–40

°C to +85°C7” Tape and Reel

RM-08

H6A