MAX15006BASASLASHV+ datasheet(2/14 Pages) MAXIM

2 / 14 page

40V, Ultra-Low Quiescent-Current

Linear Regulators in 6-Pin TDFN/8-Pin SO

Maxim Integrated

MAX15006/MAX15007

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VIN = 14V, IOUT = 1mA, CIN = 0.1µF, COUT = 2.2µF, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical specifications are at

TA = +25°C.) (Note 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

IN to GND ...............................................................-0.3V to +45V

EN to GND..............................................................-0.3V to +45V

OUT, FB to GND.....................................................-0.3V to +12V

OUT Short-Circuit Duration ........................................Continuous

Maximum Current Into Any Pin (except IN and OUT) ......±50mA

Continuous Power Dissipation (TA = +70°C)

TDFN (derate 23.8mW/°C above +70°C) ........................1904mW

SO (derate 23.3mW/°C above +70°C)..........................1860mW

Operating Temperature Range .........................-40°C to +125°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

PACKAGE THERMAL CHARACTERISTICS (Note 1)

TDFN

Junction-to-Ambient Thermal Resistance (

θJA) ...........42°C/W

Junction-to-Case Thermal Resistance (

θJC) ...............8.5°C/W

Junction-to-Ambient Thermal Resistance (

θJA) ...........43°C/W

Junction-to-Case Thermal Resistance (

θJC) ..................7°C/W

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Input Voltage Range

VIN

IOUT = 0A (MAX15006A/B/D)

IOUT = 0A (MAX15006C)

IOUT = 0A (MAX15007A/B)

IOUT = 0A (MAX15007C)

IOUT = 100μA

(MAX15006A/B/D)

10.5

IOUT = 100μA (MAX15006C)

8.5

IOUT = 100μA (MAX15007A/B)

11.5

IOUT = 100μA (MAX15007C)

9.5

IOUT = 1mA (MAX15006A/B/D)

IOUT = 1mA (MAX15006C)

IOUT = 1mA (MAX15007A/B)

IOUT = 1mA (MAX15007C)

IOUT = 50mA (MAX15006)

150

IOUT = 50mA (MAX15007)

150

Ground Current

IGND

Regulator on,

measured at GND

IOUT = 60mA (MAX15006D)

110

150

μA

Shutdown Supply Current

ISHDN

Regulator off (MAX15007 only)

μA

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