AD589 datasheet(2/4 Pages) AD

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AD589–SPECIFICATIONS

–2–

(typical @ IIN = 500 A and TA = +25 C unless otherwise noted)

AD589 CHIP DIMENSIONS AND PAD LAYOUT

0.040

(1.016)

0.060

(1.524)

THE AD589 IS AVAILABLE IN CHIP FORM WITH FULLY TESTED

AND GUARANTEED SPECIFICATIONS. CONSULT FACTORY FOR

AVAILABLE GRADES AND PRICING.

Model

AD589JH/JR

AD589KH

AD589LH

AD589MH

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

Unit

OUTPUT VOLTAGE, TA = +25°C

1.200

1.235

1.250

1.200

1.235

1.250

1.200

1.235 1.250

1.200

1.235 1.250

OUTPUT VOLTAGE CHANGE vs.

CURRENT

(50

µA–5 mA)

DYNAMIC OUTPUT IMPEDANCE

0.6

Ω

RMS NOISE VOLTAGE

10 Hz < f < 10 kHz

µV

TEMPERATURE COEFFICIENT

100

ppm/

°C

TURN-ON SETTLING TIME TO 0.1%

µs

OPERATING CURRENT

0.05

5mA

OPERATING TEMPERATURE

+70

°C

PACKAGE OPTION

Metal Can (H-02A)

AD589JH

AD589KH

AD589LH

AD589MH

SOIC (R-8)

AD589JR

Model

AD589SH

AD589TH

AD589UH

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

Unit

OUTPUT VOLTAGE, TA = +25°C

1.200

1.235

1.250

1.200

1.235

1.250

1.200

1.235 1.250

OUTPUT VOLTAGE CHANGE vs.

CURRENT

(50

µA–5 mA)

DYNAMIC OUTPUT IMPEDANCE

0.6

Ω

RMS NOISE VOLTAGE

10 Hz < f < 10 kHz

µV

TEMPERATURE COEFFICIENT

100

ppm/

°C

TURN-ON SETTLING TIME TO 0.1%

µs

OPERATING CURRENT

0.05

5mA

OPERATING TEMPERATURE

–55

+125

–55

+125

–25

+125

°C

PACKAGE OPTION

Metal Can (H-02A)

AD589SH

AD589TH

AD589UH

SOIC (SO-8)

AD589JR

NOTES

1See the following page for explanation of temperature coefficient measurement method.

2Optimum performance is obtained at currents below 500

µA. For current operation below 200 µA, stray shunt capacitances should be limited

to 20 pF or increased to 1

µF. If strays can not be avoided, operation at 500 µA and a shunt capacitor of at least 1000 pF are recommended.

3H = Hermetic Metal Can; SO = SOIC.

Specifications shown in boldface are tested on all production units at final electrical test.

Specifications subject to change without notice.

ABSOLUTE MAXIMUM RATINGS

Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA

Reverse Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA

Power Dissipation

. . . . . . . . . . . . . . . . . . . . . . . . . . . 125 mW

Storage Temperature . . . . . . . . . . . . . . . . . . . –65

°C to +175°C

Operating Junction Temperature Range . . . . –55

°C to +150°C

Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . +300

°C

NOTE

1Absolute maximum power dissipation is limited by maximum current through the

device. Maximum rating at elevated temperatures must be computed assuming

TJ ≤ 150°C, and θJA = 400 = C/W.

REV. B

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