9

PRELIMINARY DATA SHEET - Rev 1.3

05/2012

AWC6325

Figure 7: PCB Board Design Guidelines

PCB BOARD DESIGN GUIDELINES

Refer to Figure 7 for the recommended PCB metal

design, soldermask design, and stencil print patterns

when assembling with ANADIGICS modules.

It is important to note that the PCB metal design is

dependent upon several factors: the electrical and

thermal performance requirements of the product,

and the PCB-to-device interconnect pattern. The

PCB metal design recommendations primarily deal

with the PCB-to-device interconnection. Specific

board-level electrical and thermal performance re-

quirements will be dictated by the physical geometry

of the specific application and are the responsibility

of the end product manufacturer.