AD22100

REV. B

–3–

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +10 V

Reversed Continuous Supply Voltage . . . . . . . . . . . . . . –10 V

Operating Temperature . . . . . . . . . . . . . . . . –50

°C to +150°C

Storage Temperature . . . . . . . . . . . . . . . . . . –65

°C to +160°C

Output Short Circuit to V+ or Ground . . . . . . . . . . Indefinite

Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . +300

°C

permanent damage to the device. This is a stress rating only; the functional

operation of the device at these or any other conditions above those indicated in the

operation sections of this specification is not implied.

Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

ORDERING GUIDE

Guaranteed

Temperature

Package

Package

Model/Grade

Range

Description* Option

AD22100 KT

0

°C to 100°C

TO-92

TO-92

AD22100 KR

0

°C to 100°C

SOIC

SO-8

AD22100 AT

–40

°C to +85°C TO-92

TO-92

AD22100 AR

–40

°C to +85°C SOIC

SO-8

AD22100 ST

–50

°C to +150°C TO-92

TO-92

AD22100 SR

–50

°C to +150°C SOIC

SO-8

AD22100KChips

+25

°C

N/A

N/A

*Minimum purchase quantities of 100 pieces for all chip orders.

PIN DESCRIPTION

Mnemonic

Function

V+

Power Supply Input

Device Output

GND

Ground Pin must be connected to 0 V.

NC

No Connect

PIN CONFIGURATIONS

TO-92

PIN 3

PIN 2

PIN 1

GND

V+

BOTTOM VIEW

(Not to Scale)

SOIC

1

2

3

4

8

7

6

5

TOP VIEW

(Not to Scale)

AD22100

NC

NC

NC

NC

V+

NC

GND

NC = NO CONNECT

WARNING!

ESD SENSITIVE DEVICE

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD22100 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

Typical Performance Curves

50

1200

0

100

150

200

800

400

FLOW RATE – CFM

(SOIC)

250

(T0-92)

Figure 3. Thermal Resistance vs. Flow Rate

Figure 2. Thermal Response vs. Flow Rate

2

1200

4

0

8

6

10

12

14

800

400

T (T0-92)

FLOW RATE – CFM

T (SOIC)

16