CBTL06DP212

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 2 — 3 November 2011

2 of 18

NXP Semiconductors

CBTL06DP212

High-performance DisplayPort Gen2 2 : 1 multiplexer

 5 mm, 0.5 mm ball pitch TFBGA48 package

3.

Applications

switching/multiplexing

connectors

4.

Ordering information

[1]

Total height including solder balls after printed circuit board mounting = 1.15 mm maximum.

5.

Marking

[1]

Industrial temperature range.

Table 1.

Ordering information

Type number

Solder process

Package

Name

Description

Version

CBTL06DP212EE

Pb-free (SnAgCu

solder compound)

TFBGA48

plastic thin fine-pitch ball grid array package;

48 balls; body 5

 5  0.8 mm[1]

SOT918-1

Table 2.

Package marking

Line

Marking

Description

A6D212[1]

basic type number

B

xxxxxxx

diffusion lot number

C

ZPGyyww

manufacturing code:

Z = diffusion site

P = assembly site

G = lead-free

yy = year code

ww = week code