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RT9513 bảng dữ liệu(PDF) 8 Page - Richtek Technology Corporation |
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RT9513 bảng dữ liệu(HTML) 8 Page - Richtek Technology Corporation |
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8 / 9 page ![]() RT9513 8 DS9513-01 April 2011 www.richtek.com Figure 2 Temperature Regulation and Thermal Protection In order to maximize the charge rate, the RT9513 features a junction temperature regulation loop. If the power dissipation of the IC results in a junction temperature greater than the thermal regulation threshold (125 °C), the RT9513 throttles back on the charge current in order to maintain a junction temperature around the thermal regulation threshold (125 °C). The RT9513 monitors the junction temperature, TJ, of the die and disconnects the battery from the input if TJ exceeds 125 °C. This operation continues until junction temperature falls below thermal regulation threshold (125°C) by the hysteresis level. This feature prevents the chip from damage. Selecting the Input and Output Capacitors In most applications, the most important is the high-frequency decoupling capacitor on the input of the RT9513. A 1uF ceramic capacitor, placed in close proximity to input pin and GND pin is recommended. In some applications depending on the power supply characteristics and cable length, it may be necessary to add an additional 10uF ceramic capacitor to the input. The RT9513 requires a small output capacitor for loop stability. A 1uF ceramic capacitor placed between the BATT pin and GND is typically sufficient. Layout Consideration The RT9513 is a fully integrated low cost single-cell Li- Ion battery charger ideal for portable applications. Careful PCB layout is necessary. For best performance, place all peripheral components as close to the IC as possible. A short connection is highly recommended. The following guidelines should be strictly followed when designing a PCB layout for the RT9513. Input capacitor should be placed close to IC and connected to ground plane. The trace of input in the PCB should be placed far away the sensitive devices or shielded by the ground. The GND should be connected to a strong ground plane for heat sinking and noise protection. The connection of RSETA should be isolated from other noisy traces. The short wire is recommended to prevent EMI and noise coupling. Output capacitor should be placed close to IC and connected to ground plane to reduce noise coupling. 9 8 7 1 2 3 4 5 10 GND C3 C1 ACIN NC GND CHG_S PGOOD BATT NC ISETA NC EN RSETA GND The capacitor should be placed close to IC pin and connected to ground plane. The GND should be connected to a strong ground plane for heat sinking and noise protection. The connection of RSETA should be isolated from other noisy traces. The short wire is recommended to prevent EMI and noise coupling. |
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