RT9137 datasheet(13/21 Pages) RICHTEK

tên linh kiện	RT9137

Giải thích chi tiết về linh kiện	Rail-to-Rail Operational Amplifier

PDF	21 Pages

Scroll/Zoom	100%

nhà sản xuất	RICHTEK [Richtek Technology Corporation]

Trang chủ	http://www.richtek.com

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13 / 21 page

RT9137/8/9

DS9137/8/9-01 April 2011

www.richtek.com

Layout Considerations

PCB layout is very important for designing power circuits.

The following layout guidelines should be strictly followed

for best performance of the RT9137/8/9.

Place the components as close to the IC as possible.

The traces should be wide and short, especially for the

high current loop.

Connect a 0.1

μF capacitor from VIN+ to ground and

place it as close to the IC as possible for better

performance.

A series resistance may be needed at the output for

some applications.

The exposed pad of the chip should be connected to a

strong ground or VS- plane for maximum thermal

consideration.

0.00

0.20

0.40

0.60

0.80

1.00

1.20

1.40

1.60

1.80

2.00

2.20

255075

100

125

Ambient Temperature (°C)

Four-Layer PCB

TSSOP-14 (Exposed Pad)

WQFN-16L 4x4

WDFN-10L 3x3

MSOP-10

TSSOP-14

MSOP-8

TSOT-23-5

Figure 1. Derating Curves for the RT9137/8/9 Packages

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