© 2011 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FPF3003 • Rev. 1.0.0

16

Packaging Information

Figure 38. 1.6mmx1.6mm WLCSP, 16-Bumps 0.4mm Pitch

Product-Specific Dimensions

Product

D

E

X

Y

FPF3003UCX

1560μm ±30μm

1560μm ±30μm

180μm

180μm

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the

warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

BOTTOM VIEW

SIDE VIEWS

TOP VIEW

RECOMMENDED LAND PATTERN

BALL A1

INDEX AREA

1 2 3 4

A

B

C

D

SEATING

PLANE

16X

A1

0.005

CA B

F

(NSMD PAD TYPE)

Ø0.260±0.02

0.40

0.40

(X) ±0.018

(Y) ±0.018

0.625

0.547

0.06 C

0.05 C

E

D

F

0.378±0.018

0.208±0.021

NOTES:

A. NO JEDEC REGISTRATION APPLIES.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCE

PER ASME Y14.5M, 1994.

D. DATUM C IS DEFINED BY THE SPHERICAL

CROWNS OF THE BALLS.

E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS

±39 MICRONS (547-625 MICRONS).

F. FOR DIMENSIONS D, E, X, AND Y SEE

PRODUCT DATASHEET.

G. DRAWING FILNAME: MKT-UC016AArev2.

0.03 C

2X

0.03 C

2X

E

D

B

C

A

0.40

0.40

(Ø0.20)

Cu Pad

(Ø0.30) Solder

Mask Opening