DIP2450-01D3 datasheet(1/10 Pages) STMICROELECTRONICS

tên linh kiện	DIP2450-01D3

Giải thích chi tiết về linh kiện	2 G / 5 G WLAN diplexer

PDF	10 Pages

Scroll/Zoom	100%

nhà sản xuất	STMICROELECTRONICS [STMicroelectronics]

Trang chủ	http://www.st.com

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1 / 10 page

This is information on a product in full production.

June 2012

Doc ID 023193 Rev 1

1/10

10

DIP2450-01D3

2 G / 5 G WLAN diplexer

Datasheet

− production data

Features

■

Low insertion loss in pass band

■

High attenuation levels

■

High rejection of out-of-band frequencies

■

Small footprint: <1.4 mm2

Benefits

■

Very low profile (<600 µm after reflow)

■

High Q, low loss

■

High RF performance

■

Tight tolerance

■

Bill of materials and area reduction

Applications

■

WLAN

■

Bluetooth

■

Mobile phone application

■

Wireless networking

Description

This diplexer targets the use of dual band 2.4 GHz

and 5 GHz. The DIP2450-01D3 is a diplexer

dedicated to the WLAN/BT application.

It is designed using STMicroelectronics IPD

(integrated passive device) technology on non

conductive glass substrate to optimize RF

performance.

Figure 1.

Pin configuration (bump view)

Flip Chip package 4 bumps

A

B

1

2

2G

5G

ANT

GND

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