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DCPL-WB-00D3 bảng dữ liệu(PDF) 8 Page - STMicroelectronics

tên linh kiện DCPL-WB-00D3
Giải thích chi tiết về linh kiện  Wide-band, dual-path directional coupler with ISO port
PDF  11 Pages
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

DCPL-WB-00D3 bảng dữ liệu(HTML) 8 Page - STMicroelectronics

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Package information
DCPL-WB-00D3
8/11
Doc ID 17967 Rev 1
3
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 11.
Package dimensions
Figure 12.
Footprint
Figure 13.
Marking
Ø255µm +/-40µm
LB Path
HB Path
GND
LB in
LB out
GND
HB in
HB out
A1
A2
A3
B1
C1
C2
C3
B3
LB Path
HB Path
GND
LB in
LB out
GND
HB in
HB out
A1
A1
A2
A2
A3
A3
B1
B1
C1
C1
C2
C2
C3
C3
B3
B3
LB Path
HB Path
GND
LB in
LB out
GND
HB in
HB out
A1
A2
A3
B1
C1
C2
C3
B3
GND
LB in
LB out
GND
HB in
HB out
A1
A1
A2
A2
A3
A3
B1
B1
C1
C1
C2
C2
C3
C3
B3
B3
1.67mm +/- 50µm
632 µm
Copper pad diameter:
220 µm recommended
Solder stencil opening:
220 µm recommended
Solder mask opening:
300 µm minimum
x
y
x
w
z
w
Dot, ST logo
ECOPACK status
xx = marking
z = manufacturing
location
yww = datecode
(y = year
ww = week)



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