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DCPL-WB-00C2 bảng dữ liệu(PDF) 8 Page - STMicroelectronics

tên linh kiện DCPL-WB-00C2
Giải thích chi tiết về linh kiện  Wide-band, dual-path directional coupler with ISO port
PDF  11 Pages
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

DCPL-WB-00C2 bảng dữ liệu(HTML) 8 Page - STMicroelectronics

Back Button DCPL-WB-00C2 Datasheet HTML 3Page - STMicroelectronics DCPL-WB-00C2 Datasheet HTML 4Page - STMicroelectronics DCPL-WB-00C2 Datasheet HTML 5Page - STMicroelectronics DCPL-WB-00C2 Datasheet HTML 6Page - STMicroelectronics DCPL-WB-00C2 Datasheet HTML 7Page - STMicroelectronics DCPL-WB-00C2 Datasheet HTML 8Page - STMicroelectronics DCPL-WB-00C2 Datasheet HTML 9Page - STMicroelectronics DCPL-WB-00C2 Datasheet HTML 10Page - STMicroelectronics DCPL-WB-00C2 Datasheet HTML 11Page - STMicroelectronics  
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Package information
DCPL-WB-00C2
8/11
Doc ID 17994 Rev 1
3
Package information
●
Epoxy meets UL94, V0
●
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 11.
Package dimensions
Figure 12.
Footprint
Figure 13.
Marking
A1
A2
A3
B1
C1
C2
C3
B3
A1
A1
A2
A2
A3
A3
B1
B1
C1
C1
C2
C2
C3
C3
B3
B3
670 µm
315 µm dia.
1.7 mm
600µm
600µm
Copper pad diameter :
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
x
y
x
w
z
w
Dot, ST logo
ECOPACK status
xx = marking
z = manufacturing
location
yww = datecode
(y = year ww = week)



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