CPL-WB-01C2

Package information

Doc ID 15366 Rev 3

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Package information

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 6.

Package dimensions

Figure 7.

Footprint

Figure 8.

Marking

1.200 mm ± 50 µm

650 µm

670 µm

315 µm diameter

Copper pad Diameter:

250 µm recommended, 300 µm max

Solder stencil opening: 330 µm

Solder mask opening recommendation:

340 µm min for 300 µm copper pad diameter

x

y

x

w

z

w

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

E