ACE722

2A Step-down DC-DC Converter

VER1.6

4

Demo Board Bom

No.

Reference

Type

Specification

Note

1

C1

Capacitor

MLCC 10uF; SMD 0805

2

C2

Capacitor

MLCC 10uF; SMD 0805

3

D1

Diode

SS34; 40V, 3A; SMD, Shielding

4

L1

Inductor

10uH; 3A; SMD; Shielding

5

IC1

IC

ACE722; SMD SOP-8

6

R1

Resistor

SMD 0805; 30K; 1%

7

R2

Resistor

SMD 0805; 10K; 1%

Layout consideration



Careful PCB layout is critical to achieving low switching losses and clean, stable operation. The

switching power stage requires particular attention. If possible, mount all the power components on

one side of the board, with their ground terminals as close to one another as possible.



Keep the high-current paths short, especially the distance between Cin and the Vin (GND) terminals.

It is essential for stable, jitter-free operation, showing as the following figure. The ESR of Cin should

be smaller enough and the capacitance of Cin should be large enough for filtering the switching

noise across power path, a 10uF ceramic capacitor is recommended.



Keep the trace connecting to SW terminal wide enough for heat dissipation, if possible, it is better to

place some vias connected to the bottom copper for enhancement.



Route high-speed switching nodes, for example SW terminal, away from sensitive analog trace (eg.

FB terminal).