TMP87CH48DFG datasheet(7/142 Pages) TOSHIBA

tên linh kiện	TMP87CH48DFG

Giải thích chi tiết về linh kiện	TLCS-870 Series

PDF	142 Pages

Scroll/Zoom	100%

nhà sản xuất	TOSHIBA [Toshiba Semiconductor]

Trang chủ	http://www.semicon.toshiba.co.jp/eng

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7 / 142 page

TMP87CH48/CM48

2008-03-06

1. Part number

2. Package code and dimensions

Previous Part Number

(in Body Text)

Previous Package Code

(in Body Text)

New Part Number

New Package Code

OTP

TMP87CH48U

P-LQFP64-1010-0.50

TMP87CH48UG

LQFP64-P-1010-0.50E

TMP87PH48UG

TMP87CH48DF

P-QFP64-1414-0.80A

TMP87CH48DFG

QFP64-P-1414-0.80C

TMP87PH48DFG

TMP87CM48U

P-LQFP64-1010-0.50

TMP87CM48UG

LQFP64-P-1010-0.50E

TMP87PM48UG

TMP87CM48DF

P-QFP64-1414-0.80A

TMP87CM48DFG

QFP64-P-1414-0.80C

TMP87PM48DFG

*: For the dimensions of the new package, see the attached Package Dimensions diagram.

3. Addition of notes on lead solderability

The following solderability test is conducted on the new device.

Lead solderability of Pb-free devices (with the G suffix)

Test

Test Conditions

Remark

Solderability

(1) Use of Lead (Pb)

solder bath temperature

= 230°C

dipping time

= 5 seconds

the number of times

= once

use of R-type flux

(2) Use of Lead (Pb)-Free

solder bath temperature

= 245°C

dipping time

= 5 seconds

the number of times

= once

use of R-type flux

Leads with over 95% solder coverage

till lead forming are acceptable.

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