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USB0403C bảng dữ liệu(PDF) 6 Page - Protek Devices

tên linh kiện USB0403C
Giải thích chi tiết về linh kiện  350 WATT LOW CAPACITANCE TVS ARRAY
PDF  9 Pages
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nhà sản xuất  PROTEC [Protek Devices]
Trang chủ  http://www.protekdevices.com
Logo PROTEC - Protek Devices

USB0403C bảng dữ liệu(HTML) 6 Page - Protek Devices

  USB0403C Datasheet HTML 1Page - Protek Devices USB0403C Datasheet HTML 2Page - Protek Devices USB0403C Datasheet HTML 3Page - Protek Devices USB0403C Datasheet HTML 4Page - Protek Devices USB0403C Datasheet HTML 5Page - Protek Devices USB0403C Datasheet HTML 6Page - Protek Devices USB0403C Datasheet HTML 7Page - Protek Devices USB0403C Datasheet HTML 8Page - Protek Devices USB0403C Datasheet HTML 9Page - Protek Devices  
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Only One Name Means ProTek’Tion™
www.protekdevices.com
05205.R6 10/12
Page 6
USB0403 - USB0424C
aPPliCation inFoRMation
3
4
1
2
GND
SOLDER PAD
3
4
1
2
USB
IC
D+
D-
3
4
1
2
R
R
T
X
R
X
FigURe 1 - USB PRoteCtion
Two USB04xx (Unidirectional) in a Common-Mode configuration. Circuit connectivity is as follows:
• Device 1: Line 1(D+) is connected to pins 2 and 3.
• Device 2: Line 2(D-) is connected to pins 2 and 3.
• Device 1 and 2: Pins 1 and 4 connected to ground
FigURe 2 - etheRnet PRoteCtion
One USB04xxC (Bidirectional) in a Differential-Mode configuration. Circuit connectivity is as follow:
• Line 1 (R
X) is connected to pins 1 and 4.
• Line 2 (T
X) is connected to pins 2 and 3.
CiRCUit BoaRD ReCoMMenDationS
Circuit board layout is critical for electromagnetic compatibility protection. The following guidelines are recommended:
• The protection device should be placed near the input terminals or connectors, the device will divert the transient current
immediately before it can be coupled into the nearby traces.
• The path length between the TVS device and the protected line should be minimized.
• All conductive loops including power and ground loops should be minimized.
• The transient current return path to ground should be kept as short as possible to reduce parasitic inductance.
• Ground planes should be used whenever possible. For multilayer PCBs, use ground vias.



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