CUS06 datasheet(2/5 Pages) TOSHIBA

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CUS06

2010-02-01

Electrical Characteristics (Ta = 25°C)

Characteristics

Symbol

Test Condition

Min

Typ.

Max

Unit

VFM (1)

IFM = 0.1 A

⎯

0.35

⎯

VFM (2)

IFM = 0.7 A

⎯

0.42

0.45

Peak forward voltage

VFM (3)

IFM = 1.0 A

⎯

0.47

⎯

IRRM (1)

VRRM = 5 V

⎯

0.7

⎯

μA

Repetitive peak reverse current

IRRM (2)

VRRM = 20 V

⎯

3.0

μA

Junction capacitance

VR = 10 V, f = 1.0 MHz

⎯

Device mounted on a ceramic board

(board size: 50 mm × 50 mm)

(soldering land: 2 mm × 2 mm)

(board thickness: 0.64 mm)

⎯

Thermal resistance

(junction to ambient)

Rth (j-a)

Device mounted on a glass-epoxy board

(board size: 50 mm × 50 mm)

(soldering land: 6 mm × 6 mm)

(board thickness: 1.6 mm)

⎯

150

°C/W

Thermal resistance (junction to lead)

Rth (j-ℓ)

Junction to lead of cathode side

⎯

°C/W

Marking

Abbreviation Code

Part No.

CUS06

Standard Soldering Pad

Handling Precaution

Schottky barrier diodes have reverse current characteristic compared to the other diodes.

There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.

This device is VF-IRRM trade-off type, lower VF higher IRRM; therefore, thermal runaway might occur when

voltage is applied. Please take forward and reverse loss into consideration during the design.

The absolute maximum ratings are rated values and must not be exceeded during operation, even for an instant.

The following are the general derating methods that we recommend for designing a circuit using this device.

VRRM: Use this rating with reference to the above. VRRM has a temperature coefficient of 0.1%/°C. Take

this temperature coefficient into account designing a device at low temperature.

IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating

of IF(AV) and Tj be below 120°C. When using this device, take the margin into consideration by

using an allowable Tamax-IF(AV) curve.

IFSM:

This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation,

which seldom occurs during the lifespan of the device.

Tj:

Derate this rating when using a device in order to ensure high reliability. We recommend that the

device be used at Tj of below 120°C.

Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When

using a device, please design a circuit board and a soldering land size to match the appropriate thermal resistance

value.

Refer to the Rectifiers databook for further information.

Unit: mm

2.0

1.1

0.5

0.8

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