TPPM0125DBVR datasheet(10/13 Pages) TI1

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TPPM0125

150mA LOW DROPOUT REGULATOR WITH POK

SLVS388 − JULY 2001

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

THERMAL INFORMATION

The TPPM0125 is designed to provide a continuous load current of 150 mA when the maximum power

dissipation of the package is not exceeded in the application. To determine the maximum power dissipation of

the package, use the junction-to-ambient thermal resistance of the device. The basic equation is as follows:

Maximum power dissipation (W)

PD(MAX) = (TJ(MAX) − TA) / RθJA (maximum power dissipation limit)

Where:

TJ(MAX) is the maximum junction temperature of the die (less than 150°C, minimum thermal shutdown)

TA is the operating ambient temperature

RθJA is the thermal resistance and is layout dependent

The recommended minimum footprint offers a RθJA of 235°C/W.

To determine the actual power dissipation of the regulator, use the following equation:

PD = (VI − VO) IO + VI I(GND) (Watts)

Power dissipation resulting from quiescent current is negligible. When the power dissipation is excessive, the

thermal protection circuit is triggered.

TPPM0125DBVR bảng dữ liệu(PDF) 10 Page - Texas Instruments