TPS54526

SLVSB84 – MAY 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERABLE PART NUMBER

PIN

TRANSPORT MEDIA

TPS54526PWP

Tube

PowerPAD™

14

(HTSSOP) – PWP

TPS54526PWPR

Tape and Reel

–45°C to 85°C

TPS54526RSAT

Tape and Reel

Plastic Quad Flat Pack (QFN)

16

TPS54526RSAR

Tape and Reel

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

All package options have Cu NIPDAU lead/ball finish.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

VIN1, VIN2, EN

–0.3 to 20

V

VBST

–0.3 to 26

V

VBST (10 ns transient)

–0.3 to 28

V

Input voltage range

VBST (vs Sw1, SW2)

–0.3 to 6.5

V

VFB, VO, SS, PG

–0.3 to 6.5

V

SW1, SW2

–2 to 20

V

SW1, SW2 (10 ns transient)

–3 to 22

V

VREG5

–0.3 to 6.5

V

Output voltage range

PGND1, PGND2

–0.3 to 0.3

V

Voltage from GND to POWERPAD

–0.2 to 0.2

V

Human Body Model (HBM)

2

kV

Electrostatic

ESD rating

discharge

Charged Device Model (CDM)

500

V

Operating junction temperature

–40 to 150

°C

Storage temperature

–55 to 150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

TPS54526

UNITS

PWP (14) PINS

RSA (16) PINS

Junction-to-ambient thermal resistance

43.7

35.2

Junction-to-case (top) thermal resistance

33.1

40.6

Junction-to-board thermal resistance

28.4

12.3

°C/W

Junction-to-top characterization parameter

1.3

0.8

Junction-to-board characterization parameter

28.2

12.4

Junction-to-case (bottom) thermal resistance

4.7

3.6

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

Copyright © 2012, Texas Instruments Incorporated

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