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OPA820-HT

www.ti.com

SBOS587

– DECEMBER 2011

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range (unless otherwise noted).

UNIT

±6.5

V

±1.2

V

Input common-mode voltage range

V

Maximum continuous operating current at 210

°C

50

mA

Internal power dissipation

See Thermal Characteristic specifications

210

°C

–55 to 210

°C

–65 to 210

°C

Lead temperature (soldering, 10 s)

300

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to

absolute-maximum-rated conditions for extended periods may affect device reliability.

xxxx

A.

See datasheet for absolute maximum and minimum recommended operating conditions.

B.

Silicon operating life design goal is 10 years at 105

°C junction temperature (does not include package interconnect

life).

C.

The predicted operating lifetime vs. junction temperature is based on reliability modeling using electromigration as the

dominant failure mechanism affecting device wear out for the specific device process and design characteristics.

Figure 1. OPA820-HT Operating Life Derating Chart

Copyright

© 2011, Texas Instruments Incorporated

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