THS7102

ADSL (POTS) CENTRAL OFFICE LINE INTERFACE DRIVER/RECEIVER

SLOS311B− MAY 2000 − REVISED DECEMBER 2001

2

POST OFFICE BOX 655303

AVAILABLE OPTIONS

TA

PACKAGED DEVICES

TA

PowerPAD (VFP)

0

°C to 70°C

THS7102CVFP

−40

°C to 85°C

THS7102IVFP

Supply voltage, VCCL, VCCOP1, VCCOP2 (see Note 1)

17 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GND, VCCL, VCCOPx

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

400 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Rx outputs

50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

BUF outputs

50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±3 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ESD rating:

HBM

2 kV

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CDM

500 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MM

200 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Total power dissipation at (or below) 25

°C free-air temperature

(see Note 2)

See Dissipation Rating Table

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0

°C to 70°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

I-suffix

−40

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 in) from case for 10 seconds

300

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. VCCL must always be equal to VCCOP1 and VCCOP2

2. The THS7102 incorporates a PowerPAD

 on the underside of the chip. This acts as a heatsink and must be connected to a thermally

dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which

could permanently damage the device.

DISSIPATION RATING TABLE§

PACKAGE

θJA

(

°C/W)

θJC

(

°C/W)

TA = 25°C¶

POWER RATING

TA = 70°C¶

POWER RATING

TA = 85°C¶

POWER RATING

VFP

29.4

0.96

3.57 W

2.04 W

1.53 W

§ This data was taken using 2 oz. trace and copper pad that is soldered directly to a JEDEC standard 4 layer 3 in × 3 in PCB.

¶ The power rating is determined with a junction temperature of 130°C. This is the junction temperature at which distortion begins to

substantially increase. Thermal management of the PCB should strive to keep the junction temperature at or below 125

°C for the best

performance.