K12P80M50SF4 datasheet(21/58 Pages) FREESCALE

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Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental

Conditions—Natural Convection (Still Air) with the single layer board horizontal. For the LQFP, the board meets the

JESD51-3 specification. For the MAPBGA, the board meets the JESD51-9 specification.

Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental

Conditions—Forced Convection (Moving Air) with the board horizontal.

Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental

Conditions—Junction-to-Board. Board temperature is measured on the top surface of the board near the package.

Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate

temperature used for the case temperature. The value includes the thermal resistance of the interface material

between the top of the package and the cold plate.

Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental

Conditions—Natural Convection (Still Air).

6 Peripheral operating requirements and behaviors

6.1 Core modules

6.1.1 JTAG electricals

Table 12. JTAG limited voltage range electricals

Symbol

Description

Min.

Max.

Unit

Operating voltage

2.7

3.6

TCLK frequency of operation

• Boundary Scan

• JTAG and CJTAG

• Serial Wire Debug

MHz

TCLK cycle period

1/J1

—

TCLK clock pulse width

• Boundary Scan

• JTAG and CJTAG

• Serial Wire Debug

—

TCLK rise and fall times

—

Boundary scan input data setup time to TCLK rise

—

Boundary scan input data hold time after TCLK rise

—

TCLK low to boundary scan output data valid

—

TCLK low to boundary scan output high-Z

—

TMS, TDI input data setup time to TCLK rise

—

J10

TMS, TDI input data hold time after TCLK rise

—

J11

TCLK low to TDO data valid

—

J12

TCLK low to TDO high-Z

—

J13

TRST assert time

100

—

J14

TRST setup time (negation) to TCLK high

—

Peripheral operating requirements and behaviors

K12 Sub-Family Data Sheet Data Sheet, Rev. 3, 08/2012.

Freescale Semiconductor, Inc.

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