HC365 datasheet(2/5 Pages) SLS

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SL74HC365

System Logic

Semiconductor

SLS

MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

VCC

DC Supply Voltage (Referenced to GND)

-0.5 to +7.0

VIN

DC Input Voltage (Referenced to GND)

-1.5 to VCC +1.5

VOUT

DC Output Voltage (Referenced to GND)

-0.5 to VCC +0.5

IIN

DC Input Current, per Pin

±20

IOUT

DC Output Current, per Pin

±35

ICC

DC Supply Current, VCC and GND Pins

±75

Power Dissipation in Still Air, Plastic DIP+

SOIC Package+

750

500

Tstg

Storage Temperature

-65 to +150

°C

Lead Temperature, 1 mm from Case for 10 Seconds

(Plastic DIP or SOIC Package)

260

°C

*Maximum Ratings are those values beyond which damage to the device may occur.

Functional operation should be restricted to the Recommended Operating Conditions.

+Derating - Plastic DIP: - 10 mW/

°C from 65° to 125°C

SOIC Package: : - 7 mW/

°C from 65° to 125°C

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

VCC

DC Supply Voltage (Referenced to GND)

2.0

6.0

VIN, VOUT

DC Input Voltage, Output Voltage (Referenced to GND)

VCC

Operating Temperature, All Package Types

-55

+125

°C

tr, tf

Input Rise and Fall Time (Figure 1)

VCC =2.0 V

VCC =4.5 V

VCC =6.0 V

1000

500

400

This device contains protection circuitry to guard against damage due to high static voltages or electric

fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated

voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range

GND

≤(V

IN or VOUT)

≤V

CC.

Unused inputs mu st always be tied to an appropriate logic voltage level (e.g., either GND or VCC).

Unused outputs must be left open.

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