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MAX97220A bảng dữ liệu(PDF) 2 Page - Maxim Integrated Products |
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MAX97220A bảng dữ liệu(HTML) 2 Page - Maxim Integrated Products |
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2 / 19 page ![]() Differential Input DirectDrive Line Drivers/Headphone Amplifiers 2 Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (All voltages referenced to PGND.) SVDD, SVDD2, and PVDD ......................................-0.3V to +6V PVSS and BIAS .......................................................-6V to +0.3V SGND ...................................................................-0.3V to +0.3V INL-, INL+, INR-, and INR+ (A, B, and E)...-VSVDD/2 to +VSVDD/2 INL-, INL+, INR-, and INR+ (C and D) ....... (-0.75 x VSVDD) to (+0.75 x VSVDD) OUTL and OUTR..................................................-4.5V to +4.5V SHDN.......................................................................-0.3V to +6V C1P........................................................-0.3V to (VPVDD + 0.3V) C1N ....................................................... (VPVSS - 0.3V) to +0.3V OUT_ Short Circuit to PGND.....................................Continuous OUT_ Short Circuit to PVDD......................................Continuous Short Circuit Between OUTL and OUTR...................Continuous Continuous Current Into/Out of All Pins .............................20mA Continuous Power Dissipation (TA = +70NC) (Multilayer Board) TQFN (derate 20.8mW/NC above +70NC)...............1666.7mW Junction Temperature .....................................................+150NC Operating Temperature Range.......................... -40NC to +85NC Storage Temperature Range............................ -65NC to +150NC Lead Temperature (soldering, 10s) ................................+300NC Soldering Temperature (reflow) ......................................+260NC ELECTRICAL CHARACTERISTICS (VPVDD = VSVDD = VSVDD2 = 5V, VPGND = VSGND = 0V, CBIAS = 0.1µF, C1 = C2 = 1µF, RIN = 20kω, RF = 20kω (MAX97220A/ MAX97220B/MAX97220E), typical values tested at TA = +25°C, unless otherwise noted.) (Notes 2 and 3) ABSOLUTE MAXIMUM RATINGS Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. TQFN Junction-to-Ambient Thermal Resistance ( qJA) ..........48°C/W Junction-to-Case Thermal Resistance ( qJC) .................7°C/W PACKAGE THERMAL CHARACTERISTICS (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS GENERAL Supply Voltage Range PVDD, SVDD_ Guaranteed by PSRR test 2.5 5.5 V Quiescent Supply Current IPVDD No load, TA = +25NC A version 5.5 7 mA No load, TA = +25NC B/C/D/E versions 5 9 No load, VPVDD = VSVDD_ = 3.3V 5 Undervoltage Lockout UVLO PVDD falling 2.35 V Shutdown Supply Current IPVDD_SD SHDN = 0, TA = +25NC 1 10 F A Turn-On Time tON Shutdown to full operation time A/C/E versions 4.8 5.5 6.3 ms B/D versions 117 130 143 AMPLIFIERS Input Resistance RIN C/D versions only 7.4 10 12.7 kI Output Signal Attenuation in Shutdown VSHDN = 0V, RL = 10kW A/B/E versions 76 dB C/D versions 71 Gain AV C/D versions only 5.5 6 6.5 dB Output Offset Voltage VOS Unity gain, TA = +25NC 350 F V Input Common-Mode Voltage Range VCM Voltage at IN+ and IN- A/B/E versions -0.5 x VPVDD +0.5 x VPVDD V C/D versions -0.75 x VPVDD +0.75 x VPVDD Maximum Differential Input Signal VDIFF (Note 4) PVDD VP |
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