LTC2960

15

2960f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

0.25

±0.05

1.37

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.64

±0.05

(2 SIDES)

1.15

±0.05

0.70

±0.05

2.55

±0.05

PACKAGE

OUTLINE

0.45 BSC

2.00

±0.10

(4 SIDES)

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

0.40

±0.10

BOTTOM VIEW—EXPOSED PAD

0.64

±0.10

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

R = 0.05

TYP

1.37

±0.10

(2 SIDES)

1

4

8

5

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.200 REF

0.00 – 0.05

(DC8) DFN 0409 REVA

0.23

±0.05

0.45 BSC

PIN 1 NOTCH

R = 0.20 OR

0.25

× 45°

CHAMFER

DC8 Package

8-Lead Plastic DFN (2mm

× 2mm)

(Reference LTC DWG # 05-08-1719 Rev A)

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

PACKAGE DESCRIPTION

1.50 – 1.75

(NOTE 4)

2.80 BSC

0.22 – 0.36

8 PLCS (NOTE 3)

DATUM ‘A’

0.09 – 0.20

(NOTE 3)

TS8 TSOT-23 0710 REV A

2.90 BSC

(NOTE 4)

0.65 BSC

1.95 BSC

0.80 – 0.90

1.00 MAX

0.01 – 0.10

0.20 BSC

0.30 – 0.50 REF

PIN ONE ID

NOTE:

1. DIMENSIONS ARE IN MILLIMETERS

2. DRAWING NOT TO SCALE

3. DIMENSIONS ARE INCLUSIVE OF PLATING

3.85 MAX

0.40

MAX

0.65

REF

RECOMMENDED SOLDER PAD LAYOUT

PER IPC CALCULATOR

1.4 MIN

2.62 REF

1.22 REF

TS8 Package

8-Lead Plastic TSOT-23

(Reference LTC DWG # 05-08-1637 Rev A)

4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR

5. MOLD FLASH SHALL NOT EXCEED 0.254mm

6. JEDEC PACKAGE REFERENCE IS MO-193