LTC2995

19

2995f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However,noresponsibilityisassumedforitsuse.LinearTechnologyCorporationmakesnorepresenta-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

3.00

± 0.10

(4 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

1.65

± 0.05

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.65

± 0.10

(4-SIDES)

0.75

± 0.05

R = 0.115

TYP

R = 0.05

TYP

0.20

± 0.05

1

PIN 1 NOTCH

R = 0.20 TYP

OR 0.25

× 45°

CHAMFER

19 20

2

0.40 BSC

0.200 REF

2.10

± 0.05

3.50

± 0.05

(4 SIDES)

0.70

±0.05

0.00 – 0.05

(UD20) QFN 0306 REV A

0.20

±0.05

0.40 BSC

PACKAGE

OUTLINE

UD Package

20-Lead Plastic QFN (3mm

× 3mm)

(Reference LTC DWG # 05-08-1720 Rev A)