ADP5023ACPZ-1-R7 datasheet(6/28 Pages) AD

6 / 28 page

ADP5023

Data Sheet

Rev. A | Page 6 of 28

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

AVIN to AGND

−0.3 V to +6 V

VIN1, VIN2 to AVIN

−0.3 V to +0.3 V

PGND1, PGND2 to AGND

−0.3 V to +0.3 V

VIN3, VOUT1, VOUT2, FB1, FB2, FB3,

EN1, EN2, EN3, MODE to AGND

−0.3 V to (AVIN + 0.3 V)

VOUT3 to AGND

−0.3 V to (VIN3 + 0.3 V)

SW1 to PGND1

−0.3 V to (VIN1 + 0.3 V)

SW2 to PGND2

−0.3 V to (VIN2 + 0.3 V)

Storage Temperature Range

−65°C to +150°C

Operating Junction Temperature

Range

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

For detailed information on power dissipation, see the Power

Dissipation and Thermal Considerations section.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 6. Thermal Resistance

Package Type

θJA

θJC

Unit

24-Lead, 0.5 mm pitch LFCSP

°C/W

ESD CAUTION

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