ADP1853ACPZ-R7 datasheet(6/28 Pages) AD

6 / 28 page

ADP1853

Data Sheet

Rev. 0 | Page 6 of 28

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN, EN, RAMP

21 V

FB, COMP, SS, TRK, FREQ, SYNC, VCCO,

PGOOD, CLKOUT

−0.3 V to +6 V

ILIM, SW, CS to PGND

−0.3 V to +21 V

BST, DH to PGND

−0.3 V to +28 V

DL to PGND

−0.3 V to VCCO + 0.3 V

BST to SW

−0.3 V to +6 V

BST to PGND to PGND 20 ns Transients

32 V

SW, CS to PGND 20 ns Transients

25 V

DL, SW, CS, ILIM to PGND 20 ns

Negative Transients

−8 V

PGND to AGND

−0.3 V to +0.3 V

PGND to AGND 20 ns Transients

−8 V to +4 V

JA (Natural Convection)

1, 2

40°C/W

Operating Junction Temperature Range3

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Maximum Soldering Lead Temperature

260°C

1 Measured with exposed pad attached to PCB.

2 Junction-to-ambient thermal resistance (θ

JA) of the package was calculated

or simulated on multilayer PCB.

3 The junction temperature (T

J) of the device is dependent on the ambient

temperature (TA) the power dissipation of the device (PD) and the junction to

ambient thermal resistance of the package (θJA). Maximum junction

temperature is calculated from the ambient temperature and power

dissipation using the formula TJ = TA + PD × θJA.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages are

referenced to GND.

ESD CAUTION

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