ADP1047ARQZ-R7 datasheet(9/84 Pages) AD

9 / 84 page

Data Sheet

ADP1047/ADP1048

Rev. 0 | Page 9 of 84

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

Table 2.

Parameter

Rating

Supply Voltage (Continuous), VDD

3.8 V

Digital Core Supply Voltage, VCORE

2.7 V

Digital Pins

−0.3 V to VDD + 0.3 V

Analog Pins

−0.3 V to VDD + 0.3 V

AGND to DGND

−0.3 V to +0.3 V

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Maximum Junction Temperature

150°C

Peak Solder Reflow Temperature

SnPb Assemblies (10 sec to 30 sec)

240°C

RoHS-Compliant Assemblies

(20 sec to 40 sec)

260°C

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

θJA

θJC

Unit

24-Lead QSOP (RQ-24)

44.4

6.4

°C/W

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

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