CPC1908J datasheet(1/7 Pages) CLARE

tên linh kiện	CPC1908J

Giải thích chi tiết về linh kiện	i4-PAC??Power Relay

PDF	7 Pages

Scroll/Zoom	100%

nhà sản xuất	CLARE [Clare, Inc.]

Trang chủ	http://www.clare.com

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DS-CPC1908 - R07

www.clare.com

1

e3

RoHS

2002/95/EC

Characteristics

Features

• 8.5A

rms Load Current with 5°C/W Heat Sink

• Low 0.3

Ω On-Resistance

• 60V

P Blocking Voltage

• 2500V

rms Input/Output Isolation

• Low Thermal Resistance (0.35 °C/W)

• Electrically Non-conductive Thermal Pad for Heat

Sink Applications

• Low Drive Power Requirements

• Arc-Free With No Snubbing Circuits

• No EMI/RFI Generation

• Machine Insertable, Wave Solderable

Applications

• Industrial Controls / Motor Control

• Robotics

• Medical Equipment—Patient/Equipment Isolation

• Instrumentation

• Multiplexers

• Data Acquisition

• Electronic Switching

• I/O Subsystems

• Meters (Watt-Hour, Water, Gas)

• Transportation Equipment

• Aerospace/Defense

Approvals

• UL 508 Certified Component: File E69938

Pin Configuration

Description

Clare and IXYS have combined to bring OptoMOS®

technology, reliability and compact size to a new family

of high-power Solid State Relays.

As part of this family, the CPC1908 single-pole

normally open (1-Form-A) Solid State Power Relay is

rated for up to 8.5Arms continuous load current with a

5°C/W heat sink.

The CPC1908 employs optically coupled MOSFET

technology to provide 2500Vrms of input to output

isolation. The output, constructed with efficient

MOSFET switches and photovoltaic die, uses Clare’s

patented OptoMOS architecture while the input, a

highly efficient GaAlAs infrared LED, provides the

optically coupled control. The combination of low

on-resistance and high load current handling

capability makes this relay suitable for a variety of high

performance switching applications.

The unique i4-PAC package pioneered by IXYS

enables Solid State Relays to achieve the highest load

current and power ratings. This package features a

unique IXYS process where the silicon chips are soft

soldered onto the Direct Copper Bond (DCB)

substrate instead of the traditional copper leadframe.

The DCB ceramic, the same substrate used in high

power modules, not only provides 2500Vrms isolation,

but also very low thermal resistance (0.35 °C/W).

Ordering Information

Switching Characteristics

Parameter

Rating

Units

Blocking Voltage

60

VP

Load Current, TA=25°C:

With 5°C/W Heat Sink

No Heat Sink

8.5

3.5

Arms

On-Resistance

0.3

Ω

RθJC

0.35

°C/W

Part

Description

CPC1908J

i4-PAC Package (25 per tube)

Form-A

I

F

I

LOAD

10%

90%

t

on

t

off

CPC1908

Single-Pole, Normally Open

i4-PAC™ Power Relay

Số phần tương tự - CPC1908J

nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
Clare, Inc.	CPC1908J	151Kb / 6P	i4-PAC??Power Relay
IXYS Corporation	CPC1908J	198Kb / 7P	Machine Insertable, Wave Solderable
IXYS Corporation	CPC1908J	196Kb / 3P	Power Relay Branding

More results

Mô tả tương tự - CPC1908J

nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
Clare, Inc.	CPC1978J	236Kb / 5P	i4-PAC??Power Relay
	CPC1908	151Kb / 6P	i4-PAC??Power Relay
	CPC1967	145Kb / 6P	i4-PAC??Power Relay
	CPC1977	145Kb / 6P	i4-PAC??Power Relay
	CPC1978	152Kb / 6P	i4-PAC??Power Relay
	CPC1986	139Kb / 6P	i4-PAC??Power Relay
	CPC1777	915Kb / 7P	i4-PAC??DC Power Relay
	CPC1967	896Kb / 7P	i4-PAC??Power Relay
	CPC1978	910Kb / 7P	i4-PAC??Power Relay
	CPC1986	888Kb / 7P	i4-PAC??Power Relay

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CPC1908J bảng dữ liệu(HTML) 1 Page - Clare, Inc.

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