3

SC403B

Absolute Maximum Ratings

LX to PGND (V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +30

LX to PGND (V) (transient — 100ns max.) . . . . . . -2 to +30

VIN to PGND (V). . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +30

EN/PSV, PGOOD, ILIM, to GND (V). . . . . . -0.3to +(V

SS, VOUT, FB, FBL, to GND (V) . . . . . . . . . -0.3to +(V

VDD to PGND (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6

TON to AGND (V). . . . . . . . . . . . . . . . . . . . . -0.3 to +(VDD - 1.5)

ENL (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to V

IN

BST to LX (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6.0

BST to PGND (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +35

AGND to PGND (V) . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +0.3

Recommended Operating Conditions

Input Voltage (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.0 to 28

VDD to PGND (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.0 to 5.5

VOUT to PGND (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.6 to 5.5

Thermal Information

Storage Temperature (°C). . . . . . . . . . . . . . . . . . . . -60 to +150

Maximum Junction Temperature (°C) . . . . . . . . . . . . . . . 150

Operating Junction Temperature (°C) . . . . . . -40 to +125

High-side MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Low-side MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

PWM controller and LDO thermal resistance . . . . . 36

Peak IR Reflow Temperature (°C) . . . . . . . . . . . . . . . . . . . . 260

Exceeding the above specifications may result in permanent damage to the device or device malfunction. Operation outside of the parameters

specified in the Electrical Characteristics section is not recommended.

NOTES:

(1) Tested according to JEDEC standard JESD22-A114.

(2) Calculated from package in still air, mounted to 3 x 4.5 (in), 4 layer FR4 PCB with thermal vias under the exposed pad per JESD51 standards.

Unless specified: V

Electrical Characteristics

Parameter

Conditions

Min

Typ

Max

Units

Input Supplies

Sensed at ENL pin, rising edge

2.40

2.60

2.95

V

Sensed at ENL pin, falling edge

2.235

2.40

2.565

VIN UVLO Hysteresis

EN/PSV = High

0.2

V

VDD UVLO Threshold

Measured at VDD pin, rising edge

2.5

3.0

V

Measured at VDD pin, falling edge

2.4

2.9

VDD UVLO Hysteresis

0.2

V

VIN Supply Current

ENL , EN/PSV = 0V, V

8.5

20

μA

Standby mode; ENL=V

130