Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

www.cree.com/xlamp

Soldering & handling

TaBle of ConTenTS

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

inTroduCTion

This application note applies to XLamp XB-D LeDs

which have order codes in the following format.

XBDxxx-xx-xxxx-xxxxxxxxx

This application note explains how XLamp XB-D LeDs

and assemblies containing these LeDs should be

handled during manufacturing. Please read the entire

document to understand how to properly handle

XLamp XB-D LeDs.

Handling XLamp XB-D LeDs .................................2

Circuit Board Preparation & Layouts ......................4

Case Temperature (T

s) Measurement Point .............4

Notes on Soldering XLamp XB-D LeDs ...................5

Moisture Sensitivity ............................................6

XLamp XB-D LED Reflow Soldering Characteristics ..7

Chemicals & Conformal Coatings ..........................8

Assembly Storage & Handling...............................9

Tape and Reel - XB-D LeDs ................................ 10

Packaging & Labels ........................................... 11

Copyright © 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the

Cree logo and XLamp are registered trademarks of Cree, Inc. This document is provided for informational purposes only and is not

a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.