MAX5477 datasheet(2/16 Pages) MAXIM

2 / 16 page

Dual, 256-Tap, Nonvolatile, I2C-Interface,

Digital Potentiometers

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VDD = +2.7V to +5.25V, H_ = VDD, L_ = GND, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VDD = +5V,

TA = +25°C.) (Note 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

SDA, SCL, VDD to GND .........................................-0.3V to +6.0V

All Other Pins to GND.................................-0.3V to (VDD + 0.3V)

Maximum Continuous Current into H_, L_, and W_

MAX5477......................................................................

±5.0mA

MAX5478......................................................................

±1.3mA

MAX5479......................................................................

±0.6mA

Continuous Power Dissipation (TA = +70°C)

16-Pin TQFN (derate 17.5mW/°C above +70°C) .......1398mW

14-Pin TSSOP (derate 9.1mW/°C above +70°C) .........727mW

Operating Temperature Range ...........................-40°C to +85°C

Maximum Junction Temperature .....................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

PACKAGE THERMAL CHARACTERISTICS (Note 1)

TQFN

Junction-to-Ambient Thermal Resistance (

θJA) ........57.2°C/W

Junction-to-Case Thermal Resistance (

θJC) ................40°C/W

TSSOP

Junction-to-Ambient Thermal Resistance (

θJA) ......100.4°C/W

Junction-to-Case Thermal Resistance (

θJC) ................30°C/W

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DC PERFORMANCE (VOLTAGE-DIVIDER MODE)

Resolution

256

Taps

Integral Nonlinearity

INL

(Note 3)

±1

LSB

Differential Nonlinearity

DNL

(Note 3)

±0.5

LSB

Dual Code Matching

R0 and R1 set to same code (all codes)

±1

LSB

End-to-End Resistance

Temperature Coefficient

TCR

ppm/°C

Ratiometric Resistance

Temperature Coefficient

ppm/°C

MAX5477

-4

MAX5478

-0.6

Full-Scale Error

MAX5479

-0.3

LSB

MAX5477

MAX5478

0.6

Zero-Scale Error

MAX5479

0.3

LSB

DC PERFORMANCE (VARIABLE-RESISTOR MODE)

VDD = 3V

±3

Integral Nonlinearity (Note 4)

INL

VDD = 5V

±1.5

LSB

MAX5477

±1

MAX5478

±1

Differential Nonlinearity (Note 4)

DNL

MAX5479

±1

LSB

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

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