TSML1000, TSML1020, TSML1030, TSML1040

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Vishay Semiconductors

Rev. 2.0, 30-Jun-11

4

Document Number: 81033

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Fig. 9 - Relative Radiant Intensity vs. Angular Displacement

PRECAUTIONS FOR USE

1. Over-current-proof

Customer must apply resistors for protection, otherwise

slight voltage shift will cause big current change (burn out

will happen).

2. Storage

2.1 Storage temperature and rel. humidity conditions are:

5 °C to 35 °C, R.H. 60 %.

2.2 Floor life must not exceed 168 h, acc. to JEDEC level 3,

J-STD-020.

Once the package is opened, the products should be

used within a week. Otherwise, they should be kept in a

damp proof box with desiccant.

Considering tape life, we suggest to use products within

one year from production date.

2.3 If opened more than one week in an atmosphere 5 °C to

35 °C, R.H. 60 %, devices should be treated at 60 °C

± 5 °C for 15 h.

2.4 If humidity indicator in the package shows pink color

(normal blue), then devices should be treated with the

same conditions as 2.3.

REFLOW SOLDER PROFILE

Fig. 10 - Lead Tin (SnPb) Reflow Solder Profile

Fig. 11 - Lead (Pb)-Free Reflow Solder Profile acc. J-STD-020

18234

0.6

0.9

0.8

0°

30°

10°

20°

40°

50°

60°

70°

80°

0.7

1.0

0.6

0.4

0.2

0

0.2

0.4

60

80

100

120

140

160

180

200

220

240

260

0

20 40 60 80 100 120 140 160 180 200 220

Time (s)

17172

+ 5 °C/s

5 s

60 s to 120 s

- 5 °C/s

22566

120 s max.

60 s max.

above 220 °C

260 °C max.

10 s max.

Pre-heating

180 °C to 200 °C

1 °C/s to 5 °C/s

1 °C/s to 5 °C/s