TUSB9261 datasheet(17/24 Pages) TI

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TUSB9261

www.ti.com

SLLSE67B

– MARCH 2011 – REVISED MAY 2011

6.3

Oscillator

XI should be tied to the 1.8-V clock source and XO should be left floating.

VSSOSC should be connected to the PCB ground plane.

A 20-, 25-, 30- or 40-MHz clock can be used.

Table 6-1. Oscillator Specification

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNIT

CXI

XI input capacitance

TJ = 25°C

0.414

VIL

Low-level input voltage

0.7

VIH

High-level input voltage

1.05

Ttosc_i

Frequency tolerance

Operational temperature

–50

ppm

Tduty

Duty cycle

TR/TF

Rise/Fall time

20% - 80 %

Reference clock RJ

JTF (1 sigma)(1)(2)

0.8

Reference clock TJ

JTF (total p-p)(2)(3)

Tp-p

Reference clock jitter

(absolute p-p)(4)

(1)

Sigma value assuming Gaussian distribution

(2)

After application of JTF

(3)

Calculated as 14.1 x RJ + DJ

(4)

Absolute phase jitter (p-p)

6.4

Crystal

A parallel, 20-pF load capacitor should be used if a crystal source is used.

VSSOSC should not be connected to the PCB ground plane.

A 20-, 25-, 30- or 40-MHz crystal can be used.

Table 6-2. Crystal Specification

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNIT

Oscillation mode

Fundamental

Oscillation frequency

MHz

20 MHz and 25 MHz

ESR

Equivalent series resistance

30 MHz

40 MHz

Ttosc_i

Frequency tolerance

Operational temperature

±50

ppm

Frequency stability

1 year aging

±50

ppm

Load capacitance

Crystal and board stray

CSHUNT

4.5

capacitance

Drive level (max)

0.8

CLOCK CONNECTIONS

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