ECMF04-4AMX12

Recommendation on PCB assembly

Doc ID 17793 Rev 2

11/13

5.5

Reflow profile

Figure 19.

ST ECOPACK® recommended soldering reflow profile for PCB mounting

Note:

Minimize air convection currents in the reflow oven to avoid component movement.

5.6

Layout recommendation

Connection to PCB GND must be as short as possible to ensure ESD remaining voltage

Figure 20.

Layout recommendation

0

01

2345

67

Time (min)

Temperature (°C)

2°C/s recommended

6°C/s max

220°C

125 °C

260°C max

255°C

180°C

90 sec max

10-30 sec

90 to 150 sec

3°C/s max

0

01

2345

67

Time (min)

Temperature (°C)

2°C/s recommended

6°C/s max

220°C

125 °C

260°C max

255°C

180°C

90 sec max

10-30 sec

90 to 150 sec

3°C/s max

Vias to GND plane

Zdiff according to

the application