IRFJ240

Document Number 5265

Issue 1

Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed

to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use.

Semelab encourages customers to verify that datasheets are current before placing orders.

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

Reference to 25°C

f = 1MHz

Drain – Source Breakdown Voltage

Temperature Coefficient of

Breakdown Voltage

Static Drain – Source On–State

Resistance

Gate Threshold Voltage

Forward Transconductance

Zero Gate Voltage Drain Current

Forward Gate – Source Leakage

Reverse Gate – Source Leakage

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

Total Gate Charge

Gate – Source Charge

Gate – Drain (“Miller”) Charge

Turn–On Delay Time

Rise Time

Turn–Off Delay Time

Fall Time

Continuous Source Current

Pulse Source Current

Diode Forward Voltage

Reverse Recovery Time

Reverse Recovery Charge

200

1.42

0.14

0.18

24

69

250

1000

100

-100

1275

500

160

43

60

16

27

16

30

27

60

40

80

31

60

13

50

2

650

4.1

5.0

12.5

V

V/°C

Ω

V

Ω

μA

nA

pF

nC

ns

A

V

ns

μC

nH

STATIC ELECTRICAL RATINGS

DYNAMIC CHARACTERISTICS

SOURCE – DRAIN DIODE CHARACTERISTICS

Internal Drain Inductance

(from 6mm down drain lead pad to centre of die)

PACKAGE CHARACTERISTICS

* Pulse width

≤ 300μs; Duty Cycle ≤ 2%