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GP2W0104YP bảng dữ liệu(PDF) 1 Page - Sharp Corporation

tên linh kiện GP2W0104YP
Giải thích chi tiết về linh kiện  115 kbps Transceiver
PDF  14 Pages
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nhà sản xuất  SHARP [Sharp Corporation]
Trang chủ  http://sharp-world.com/
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GP2W0104YP bảng dữ liệu(HTML) 1 Page - Sharp Corporation

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IrDA Data Sheet
1
GP2W0104YP
IrDA Data Sheet
115 kbps Transceiver
FEATURES
• Built-in Photodiode
• Operating voltage 2.4 V to 5.5 V
• Conforms to eye safety IEC60825-1, without exter-
nal resistor
• This product shall not contain the following materi-
als, and these materials shall not be used in the pro-
duction process for this product.
–CFCs
– Halon
– Carbon Tetrachloride
– 1.1.1. Trichloroethane (Methylchloroform)
– Specific brominated flame retardants such as the
PBBOS and PBBS are not used in this device.
INTRODUCTION
This specification applies to the outline and charac-
teristics of IrDA 1.2 type (data rate 2.4 kbps to 115.2
kbps, low power option compliant).
NOTES
• Caution should be taken to prevent the detector sur-
face from being smeared with dust or dirt, or from
being touched, as it may cause faulty operation.
• Cleaning conditions:
– Solvent cleaning: Solvent temperature 45°C or
less. Immersion for 3 minutes or less.
– Ultrasonic cleaning: The effect of ultrasonic
cleaning on the device differs by cleaning bath
size, ultrasonic power output, cleaning time, PCB
size or device mounting condition, etc. Test the
device under actual conditions and confirm that
ultrasonic cleaning does not cause any immedi-
ate or potential defects.
– Cleaning solvent: The cleaning shall be carried out
with ethyl alcohol, methyl alcohol, isopropyl alcohol.
• In order to prevent electrostatic damage to the inte-
grated circuit, handle this device in a static-free envi-
ronment and workstation.
• External force applied to the device after mounting can
cause mounting defects such as the terminal coming
off. Be careful when handling the device and prevent
objects from touching the device after mounting.
• Refer to the ‘Precautions for Soldering’ section.
• When the system (program) is designed, the turn
around time from transmit to receive should be
designed by considering 0.5 ms or more that is spec-
ified by IrDA. This turn around time means the time
that this device does not temporarily detect the
inconsistent signal, since the transmitted light from
the transmitter side reaches the detector side of the
same transceiver.
• When designing the system (program), consider that
0.3 ms or more (at TA = 25°C, no input signal) is nec-
essary to return from shut-down mode to ready-
operation mode. In addition, thoroughly confirm the
operation in the actual application.
• When there is considerable external stray light or a
light source is located near the transceiver, or the
detector face receives considerable external stray
light, a pulse other than signal output may be gener-
ated as noise on output terminal of the transceiver.
Consider the layout and structure in your design to
minimize disturbing light on the detector face.
• When the sensor is adopted in an IR communication
system, it should be used according to the signal
method which is specified by ‘Serial Infrared Physical
Layer Link Specification’ published by the Infrared
Data Association. Faulty operation may occur, if a sig-
nal method other than that specified is used.
• RXD pinout remains at high-level output in shutdown
mode. The RXD pinout is CMOS output, and other
CMOS outputs must not be directly connected to this
pinout, as it does not conform to tri-state output.
• In circuit designs, make allowance for the degradation
of the light emitting diode output that results from long-
term continuous operation (50% degradation/5 years).
Figure 1. Recommended External Circuit
1
NC
2
NC
3
VDD
4
GND
GP2W0104YP-1
CX
VDD GND SD RXD TXD
5
SD
6
RXD
7
TXD
8
LEDA
+
COMPONENTS
NOTES:
1. Choose the most suitable CX according to the
noise level and noise frequency of power supply.
2. Pin 1 and Pin 2 are not connected internally.
RECOMMENDED VALUES
CX
10
µF/6.3 V (NOTE 1)


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