TPS2000C datasheet(16/26 Pages) TI1

16 / 26 page

IN: 0.0145in

2 area

& 2 x 0.018in vias

GND: 0.056in

2 total area

& 3 x 0.018in vias

OUT

OUT:

0.048in

2 total area

5 x 0.01in vias

0.050in trace

OUT

VIN: 0.00925in

& 3 x 0.018in vias

VOUT: 0.041in

2 total

0.050in trace

4 x 0.01in vias

GND: 0.052in

2 Total

& 3 x 0.018in vias

TPS20xxC

SLVSAU6A –JUNE 2011–REVISED JULY 2011

www.ti.com

Figure 41. DBV Package PCB Layout Example

Figure 42. DGN Package PCB Layout Example

The following procedure requires iteration because power loss is due to the internal MOSFET I2 × RDS(ON), and

RDS(ON) is a function of the junction temperature. As an initial estimate, use the RDS(ON) at 125°C from the

TYPICAL CHARACTERISTICS, and the preferred package thermal resistance for the preferred board

construction from the THERMAL INFORMATION table.

TJ = TA + ((IOUT2 x RDS(ON)) x θJA)

(1)

Where:

IOUT = rated OUT pin current (A)

RDS(ON) = Power switch on-resistance at an assumed TJ (Ω)

TA = Maximum ambient temperature (°C)

TJ = Maximum junction temperature (°C)

θJA = Thermal resistance (°C/W)

If the calculated TJ is substantially different from the original assumption, estimate a new value of RDS(ON) using

the typical characteristic plot and recalculate.

If the resulting TJ is not less than 125°C, try a PCB construction and/or package with lower θJA .

SPACER

REVISION HISTORY

Changes from Original (June 2011) to Revision A

Page

•

Updated MSOP Devices Status From: Preview To: Active .................................................................................................. 1

•

Corrected pinout numbers for the 5-PIN PACKAGE ............................................................................................................ 6

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