SE98ATP datasheet(2/43 Pages) NXP

2 / 43 page

SE98A_4

Product data sheet

Rev. 04 — 25 November 2009

2 of 43

NXP Semiconductors

SE98A

DDR memory module temp sensor, 1.7 V to 3.6 V

Operating current: 250

μA (typ.) and 400 μA (max.)

Programmable hysteresis threshold: 0

°C, 1.5 °C, 3 °C, 6 °C

Over/under/critical temperature EVENT output

B grade accuracy:

±0.5 °C/±1 °C (typ./max.) → +75 °C to +95 °C

±1 °C/±2 °C (typ./max.) → +40 °C to +125 °C

±2 °C/±3 °C (typ./max.) →−40 °C to +125 °C

ESD protection exceeds 2000 V HBM per JESD22-A114, 250 V MM per

JESD22-A115, and 1000 V CDM per JESD22-C101

Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA

Available packages: TSSOP8, HWSON8 (PSON8 VCED-3) and HXSON8

Applications

DDR2 and DDR3 memory modules

Laptops, personal computers and servers

Enterprise networking

Hard disk drives and other PC peripherals

Ordering information

[1]

Industry standard 2 mm

× 3mm × 0.8 mm package to JEDEC VCED-3 PSON8 in 8 mm × 4 mm pitch tape 4 k quantity reels.

Table 1.

Ordering information

Type number

Topside

mark

Package

Name

Description

Version

SE98APW

S98A

TSSOP8

plastic thin shrink small outline package; 8 leads;

body width 4.4 mm

SOT530-1

SE98ATP[1]

98A

HWSON8

plastic thermal enhanced very very thin small outline package;

no leads; 8 terminals; body 2

× 3 × 0.8 mm

SOT1069-2

SE98ATL

8AL

HXSON8

plastic thermal enhanced extremely thin small outline package;

no leads; 8 terminals; body 2

× 3 × 0.5 mm

SOT1052-1

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