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VRF154FLMP bảng dữ liệu(PDF) 5 Page - Microsemi Corporation

tên linh kiện VRF154FLMP
Giải thích chi tiết về linh kiện  RF POWER VERTICAL MOSFET
PDF  5 Pages
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nhà sản xuất  MICROSEMI [Microsemi Corporation]
Trang chủ  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

VRF154FLMP bảng dữ liệu(HTML) 5 Page - Microsemi Corporation

  VRF154FLMP Datasheet HTML 1Page - Microsemi Corporation VRF154FLMP Datasheet HTML 2Page - Microsemi Corporation VRF154FLMP Datasheet HTML 3Page - Microsemi Corporation VRF154FLMP Datasheet HTML 4Page - Microsemi Corporation VRF154FLMP Datasheet HTML 5Page - Microsemi Corporation  
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VRF154FL(MP)
PIN 1 - DRAIN
PIN 2 - SOURCE
PIN 3 - SOURCE
PIN 4 - GATE
HAZARDOUS MATERIAL WARNING
The ceramic portion of the device between leads and
mounting flange is beryllium oxide. Beryllium oxide dust
is highly toxic when inhaled. Care must be taken during
handling and mounting to avoid damage to this area.
These devices must never be thrown away with general
industrial or domestic waste.
1.000
.500
.150r
.500
.466
.750
1.500
1.250
.300
.200
.250
.250
.005 .040
.125d
1
2
4
3
D
S
G
Microsemi’s products are covered by one or more of U.S. patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583
4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743, 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262
and foreign patents. US and Foreign patents pending. All Rights Reserved.
Thermal
Considerations
and
Package
Mounting:
The rated 1350W power dissipation is only available
when the package mounting surface is at 25°C and
the junction temperature is 200 °C. The thermal re-
sistance between junctions and case mounting surface
is 0.13°C/W. When installed, an additional thermal im-
pedance of 0.09°C/W between the package base and
the mounting surface is smooth and flat. Thermal joint
compound must be used to reduce the effects of small
surface irregularities. The heatsink should incorporate
a copper heat spreader to obtain best results.
The lid
maintains the required mounting pressure while al-
lowing for thermal expansion of both the device and
the heat sink. Four 6-32 (M3.5) screws provide the
minimum 125 lb. required mounting force. T=4-6 in-lb.
Please refer to App Note 1802 "Mounting Instructions
for Flangeless Packages."
Adding MP at the end of P/N specifies a matched pair where V
GS(TH) is matched between the two parts. VTH values
are marked on the devices per the following table.
Code
Vth Range
Code 2
Vth Range
A
2.900 - 2.975
M
3.650 - 3.725
B
2.975 - 3.050
N
3.725 - 3.800
C
3.050 - 3.125
P
3.800 - 3.875
D
3.125 - 3.200
R
3.875 - 3.950
E
3.200 - 3.275
S
3.950 - 4.025
F
3.275 - 3.350
T
4.025 - 4.100
G
3.350 - 3.425
W
4.100 - 4.175
H
3.425 - 3.500
X
4.175 - 4.250
J
3.500 - 3.575
Y
4.250 - 4.325
K
3.575 - 3.650
Z
4.325 - 4.400
V
TH values are based on Microsemi measurements at datasheet conditions with an accuracy of 1.0%.



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