LT3597

23

3597f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

UHG Package

Variation: UHG52 (39)

52-Lead Plastic QFN (5mm

× 8mm)

(Reference LTC DWG # 05-08-1846 Rev B)

5.00

± 0.10

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

PIN 1

TOP MARK

(SEE NOTE 6)

51

50

48

46

44

43

41

39

37

35

34

33

32

31

30

29

28

27

43

48

46

44

51 50

41

39

37

35

34

33

32

31

30

29

28

27

2

4

6

7

9

11

12

13

14

15

16

17

2

4

6

7

9

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

BOTTOM VIEW—EXPOSED PAD

5.90

±0.10

6.40 REF

8.00

± 0.10

0.75

± 0.05

0.75

± 0.05

R = 0.10

TYP

R = 0.10

TYP

0.20

± 0.05

(UHG39) QFN 0410 REV B

0.40 BSC

0.80 BSC

0.70 TYP

0.60 TYP

0.200 REF

0.00 – 0.05

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

3.20 REF

0.40

±0.10

0.00 – 0.05

18 19 20 21 22 23 24 25 26

0.70

± 0.05

41

39

37

35

34 33 32 31 30 29 28 27

26

25

24

23

22

21

20

19

18

17

16

15

14

13

12

11

9

7

6

4

2

43

44

46

48

50

51

0.40 BSC

0.80 BSC

6.40 REF

3.20 REF

4.10

± 0.05

5.50

± 0.05

0.20

± 0.05

5.90

±0.05

2.90

±0.05

7.10

± 0.05

8.50

± 0.05

PACKAGE

OUTLINE

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1 NOTCH

R = 0.30 TYP OR

0.35

× 45° CHAMFER

2.90

±0.10