4

RoHS Compliant

Rev. V4

MA4SPS302

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383

• China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Handling

All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin

oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.

Bulk handling should insure that abrasion and mechanical shock are minimized.

Die Attach

Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are

conveniently located on the bottom surface of these devices and are removed from the active junction locations.

These devices are well suited for solder attachment onto hard and soft substrates. The use of 80/20, Au/Sn,

60/40, Sn/Pb or RoHS compliant solders is recommended. Conductive silver epoxy solder may also be used but

could result in an increase in series and thermal resistance.

When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a

vacuum tip and force of 60 to 100 grams applied to the top surface of the device. When soldering to soft

substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so

that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit

trace near the mounting pads while applying 60 to 100 grams of force perpendicular to the top surface of the die.

The solder joint must not be made one pad at a time. Doing so could create unequal heat flow and produce

thermal and/or mechanical stresses to the die . It is also not recommended to reflow solder by causing heat to

flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads can

be visually inspected through the die after attach is completed.

Recommended temperature and re-flow profiles for 60/40, Sn/Pb and RoHS compliant solders are provided in

Application Note M538 , “Surface Mounting Instructions“.

Procedures for Chip Diode Devices” provides handling and assembly recommendations.

Ordering Information

The MA4SPS302 SURMOUNT are packaged in gel packs.

Part Number

Gel Pack

MA4SPS302