AP9050

PROTECTION INTERFACE for PMICs with

INTEGRATED OVP CONTROL

AP9050

Document number: DS35283 Rev. 1 - 2

3 of 9

www.diodes.com

March 2011

© Diodes Incorporated

Symbol

Parameter

Rating

Unit

Supply Voltage

−0.3 to 30

V

Gate-to-Source Voltage

±12

V

Drain Current, Peak (10µs pulse)

19

A

Drain Current, Continuous

(Note 4, Steady-State)

3.7

2.7

A

(Note 3, 4)

750

mW

Junction Temperature Range

−40 to +125

°C

Non-operating Temperature Range

−55 to +150

°C

Maximum Lead Temperature for Soldering

Purposes

260

°C

Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and

transporting these devices.

Notes:

2. Exceeding these ratings may damage the device.

3. Mounted on FR4 Board using 30 mm

2

, 2 oz Cu.

4. Dual die operation (equally

−heated).

Thermal Resistance

Symbol

Parameter

Rating

Unit

Junction to Ambient (Note 5)

132

°C/W

Junction to Case

13

°C/W

Note:

5. Test condition for DFN2020-6: Mounted on FR4 Board using 30 mm

2

, 2 oz Cu.

Symbol

Parameter

Min

Max

Unit

Supply Voltage

3

30

V

Operating Ambient Temperature Range

−40

+85

°C

Note:

6. The device function is not guaranteed outside of the recommended operating conditions.