www.austriamicrosystems.com/DC-DC_Step-Up/AS1310

Revision 1.04

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AS1310

Datasheet - Detailed Descr i p ti on

Figure 14. Typical Application with LBO working as Power-OK

Thermal Shutdown

To prevent the AS1310 from short-term misuse and overload conditions the chip includes a thermal overload protection. To block the normal

operation mode all switches will be turned off. The device is in thermal shutdown when the junction temperature exceeds 150°C. To resume the

normal operation the temperature has to drop below 140°C.

A good thermal path has to be provided to dissipate the heat generated within the package. Otherwise it’s not possible to operate the AS1310 at

its useable maximal power. To dissipate as much heat as possible from the package into a copper plane with as much area as possible, it’s rec-

ommended to use multiple vias in the printed circuit board. It’s also recommended to solder the Exposed Pad (pin 9) to the GND plane.

Note:

Continuing operation in thermal overload conditions may damage the device and is considered bad practice.

0.7V to 3.6V

AS1310

22µF

On

Off

22µF

GND

2

1.8V to 3.3V

7

EN

8

VIN

4

VOUT

6

LBO

1

LBI

Low Battery Detect

L1

6.8µH

LX

3

100nF

5

REF